Tensile test on overlap bonding

Including measurement of the shear path with integrated Kelber thickness measurement

A special feature of this test is that an additional bonding of an adapter piece creates a thickness compensation. This test setup allows a conventional clamp-on extensometer to be used for the finest displacement of the bonding surfaces. This has a measuring path resolution of 0,000.1 mm.

In order to make the results comparable, the area of ​​the bond is measured before the test (sample width and length of the overlap). The determined maximum test force is divided by this area to determine a shear stress.

Since the test pieces are relatively stiff, the clamping device must be offset to avoid bending influences on the bonding point. This was achieved by a special clamping device realized. In this case, a center offset of the upper to the lower clamping plane can be achieved by manually adjusting the left clamping surface.