Tensile shear test on overlapping bonds

Including high-resolution measurement of the shear path

A unique feature of this experiment is the use of an additional adhesive to compensate for thickness differences in an adapter piece. This setup allows the use of a conventional clamp-on extensometer for measuring the minute displacement of the bonded surfaces. This extensometer has a measuring resolution of 0,000.1 mm.

In order to make the results comparable, the area of ​​the bond is measured before the test (sample width and length of the overlap). The determined maximum test force is divided by this area to determine a shear stress.

Since the test pieces are relatively stiff, the clamping device must be offset to prevent any bending effect on the adhesive joint. This was achieved using a special clamping device . With this device, a center offset between the upper and lower clamping planes can be achieved by manually adjusting the left clamping surface.

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