Electrolytic polishing and etching

ELOPREP 102 – electrolytic metallography preparation

Electrolytic preparation is one of the most efficient methods of Metallography – Preparation because the processing is carried out unmanned once the process has started. In addition to the advantage of rationalization, material is removed with absolutely no stress. Unlike with conventional metallographic grinding and polishing, no mechanical deformation or even heat can be introduced - surface hardening is impossible. The principle is based on the electrochemical removal process with a power source. Metal particles are anodically removed in an electrolyte suitable for the respective metal and with an adjusted current strength. The material sample forms the anode within the electrochemical cell. During the process, particles from the sample surface are continuously removed, thus reducing the surface roughness. The principle works because the peaks are removed faster than the valleys - the surface is leveled.

Highlights ELOPREP 102

  • Automatic, programmable polishing + etching
  • easily programmable SIEMENS PLC control + 7 inch color LCD touchscreen
  • Scan function for easy determination of parameters
  • short polishing time, excellent reproducibility
  • separate polishing device with drain pipe + integrated cooling system
  • 2 polishing / etching units can be controlled in parallel with one electronic unit
  • Voltage polishing: 0-100V, etching 0-25V, external etching 0-25V
  • variable polishing time / current intensity with current limitation
  • built-in safety functions with constant electrolyte monitoring
  • speed-controlled pump with magnetic stirrer for electrolyte flow
  • suitable for electrolytic polishing at normal + low temperature
  • ready-to-use delivery including stainless steel cathode
  • Option: external etching option
ELOPREP 102 for polishing and etching
ELOPREP 102 for polishing and etching

Video ELOPREP 102 electrolytic polishing and etching

Technical data

Order number

46 02

temperature limiter 

30 - 50 ° C

Pump

magnetic stirrer

electrolyte vessel volume / external container

1000 / 1200 ml

cooling system

Integrated

polishing at low temperatures

Ja

dimensions of the mask

0 – 0,5 – 1 – 2 – 5 cm²

scan function

Automatic

Service

7″ HMI touchscreen

program memory

99

Output voltage / current: polishing | etching | external etching

0-120 | 0 – 35 | 0 – 25 volts

Power Supply

110/120V | 230V 

Dimensions W x D x H mm Control | Polishing unit

404x370x305 | 210x370x305

Weight kg Control unit | Polishing unit

20 | 5

Accessories

Optional accessories for ELOPREP 102

46 09

Additional polishing and etching unit

Suitable for electrolytic polishing at normal and low temperatures

Two polishing and etching units that can be operated by the same control unit

Must be ordered at the same time as ELOPREP 102

46 10

External etching unit for large parts

46 08

electrolyte container with lid

46 12

1 set of 5 masks (apertures) 0,5 cm²

46 13

1 set of 5 masks (apertures) 1cm²

46 14

1 set of 5 masks (apertures) 2cm²

46 15

1 set of 5 masks (apertures) 5cm²

46 16

1 set of 5 masks (without apertures)

46 17

1 set of masks (0,5 |1 |2 |5 cm² and one without aperture)

YM 6904-00

stainless steel cathode

YM 6937-00

copper cathode

YM 6936-00

titanium cathode

request ELOPREP 102

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